Warning! You won't be able to use the quotation basket until you enable cookies in your Web browser.
Warning! Your Web browser is no longer supported. Please upgrade to a modern browser.

Leica Biosystems introduces ACD’s RNAscope technology for use on BOND-III

Published: 

BOND RNAscope on BOND-III is an advanced and novel technology born out of the partnership between Advanced Cell Diagnostics (now ACD, a Bio-Techne brand) and Leica Biosystems.

What makes this technology “advanced and novel”?

For decades, pathologists have clamored for a robust, automated technology for the detection of RNA that fits into the existing anatomic pathology laboratory workflow. RNAscope on BOND-III provides numerous advantages over traditional RNA ISH methodologies, including:

  • Signal Amplification with Background Suppression…CLEAN, CRISP, HIGHLY SPECIFIC STAINING
  • Single Molecule Detection…HIGH SENSITIVITY
  • Conserved Tissue/Cell Morphology…VISUAL MORPHOLOGICAL CONTEXT
  • Automated Protocol on BOND-III…READY-TO-USE for Formalin-fixed, Paraffin-embedded Tissue

The BOND-III is the first clinical instrument to utilize the RNAscope technology. BOND RNAscope Detection Reagents – BROWN and BOND RNAscope Protease are now available in the U.S. through Leica Biosystems, with more countries to follow in the future. These two BOND Ready-to-Use products enable laboratories to experience the combined benefits of RNAscope technology and BOND-III automation.

 

Copyright © 2017 Leica Biosystems Newcastle Ltd. All rights reserved. LEICA and the Leica Logo are registered trademarks of Leica Microsystems IR GmbH. BOND is a trademark of the Leica Biosystems group of companies in the USA and optionally in other countries. Other logos, product and/or company names might be trademarks of their respective owners.

RNAscope® is a registered trademark of Advanced Cell Diagnostics, Inc. in the United States or other countries. All rights reserved. © 2017 Advanced Cell Diagnostics, Inc.

95.14636 Rev A  03/2017

RNAscope technology for use on BOND-III